CPC H01B 1/22 (2013.01) [B22F 1/0547 (2022.01); B22F 1/07 (2022.01); B22F 1/102 (2022.01); B22F 9/24 (2013.01); C08J 3/201 (2013.01); C08J 3/2053 (2013.01); C08J 3/215 (2013.01); C08K 3/08 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); C09K 5/14 (2013.01); B22F 1/107 (2022.01); B22F 2301/10 (2013.01); B22F 2304/054 (2013.01); C08K 2003/085 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01); C08K 2201/016 (2013.01)] | 15 Claims |
1. A plastic copper nanowire composition, comprising:
a plastic, wherein the plastic is polyethylene, polypropylene, a copolymer of ethylene with propylene or vinyl acetate, a terpolymer of acrylonitrile, butadiene, and styrene, polyvinylchloride, poly(methyl methacrylate), polycarbonate, nylon, polyurethane, epoxy, poly(ethylene terephthalate), or poly(vinyl ester); and
copper nanowires having an associated ligand with a structure HNR1R2, wherein R1 is hydrogen or an alkyl group, R2 is an arylalkyl group, and the copper nanowires having the associated ligand are dispersed uniformly throughout the plastic.
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