US 12,293,504 B2
Semiconductor package inspection with predictive model for wirebond radio frequency performance
Ian A. Cleary, Phoenix, AZ (US); and Timothy M. Beck, San Marcos, CA (US)
Assigned to VIASAT, INC., Carlsbad, CA (US)
Filed by VIASAT, INC., Carlsbad, CA (US)
Filed on May 6, 2022, as Appl. No. 17/662,281.
Prior Publication US 2023/0360188 A1, Nov. 9, 2023
Int. Cl. G06T 7/60 (2017.01); G06T 7/00 (2017.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01)
CPC G06T 7/0004 (2013.01) [G06T 7/60 (2013.01); H01L 22/12 (2013.01); H01L 24/48 (2013.01); G06T 2207/10048 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01); H01L 2224/48227 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A method of inspection of a semiconductor package having a die and die substrate during semiconductor package manufacture, comprising:
forming one or more wirebond interconnections between the die and the die substrate;
capturing input data representative of one or more wirebond interconnection features during the inspection of the one or more formed wirebond interconnections, the input data comprising one or more digital images captured of the one or more formed wirebond interconnections;
processing the captured input data using a machine learning (ML) model to obtain an output array of data having a predicted value indicative of a radio-frequency (RF) performance of the semiconductor package with the one or more formed wirebond interconnections, wherein the ML model is trained based on wirebond parameters and RF performance parameters;
evaluating the output array of data to determine an RF (RF) performance rating for the semiconductor package;
outputting the RF performance rating; and
rejecting or passing a manufacture of the package according to the output RF performance rating.