US 12,293,247 B2
RF communication device without temporary connection line, and manufacturing method
Egas Carvalho Henes Neto, Graz (AT); Slawomir Rafal Malinowski, Graz (AT); Ivan Jesus Rebollo Pimentel, Graz (AT); and Thomas Pichler, Graz (AT)
Assigned to NXP B.V., Eindhove (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Jun. 13, 2022, as Appl. No. 17/806,547.
Claims priority of application No. 21182107 (EP), filed on Jun. 28, 2021.
Prior Publication US 2022/0414357 A1, Dec. 29, 2022
Int. Cl. G06K 7/10 (2006.01); G06K 19/07 (2006.01)
CPC G06K 7/10356 (2013.01) [G06K 19/0726 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A radio frequency (RF) communication device, comprising an integrated circuit (IC) chip that contains:
a first pad configured to be electrically coupled to a first antenna segment, and configured to receive RF energy from the first antenna segment;
an RF antenna circuit electrically coupled to the first pad;
a second pad configured to be electrically coupled to the first antenna segment, and configured to receive the RF energy from the first antenna segment;
a test circuit configured to generate a control signal based on the RF energy; and
a first control element coupled between the test circuit and the second pad, wherein the first control element is configured to receive the control signal, wherein when the control signal has a first value, the first control element is configured to operate in a test mode in which the first control element electrically couples the test circuit and the second pad, and when the control signal has a second value, the first control element is configured to operate in an RF communication mode in which the first control element electrically isolates the test circuit from the second pad.