US 12,292,850 B2
Communication system between dies and operation method thereof
Yung-Sheng Fang, Hsinchu (TW); Igor Elkanovich, Hsinchu (TW); and Pei Yu, Hsinchu (TW)
Assigned to Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Global Unichip Corporation, Hsinchu (TW); and Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 23, 2023, as Appl. No. 18/322,537.
Prior Publication US 2024/0394210 A1, Nov. 28, 2024
Int. Cl. G06F 13/42 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H04B 1/50 (2006.01)
CPC G06F 13/4282 (2013.01) [G06F 2213/0002 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A die-to-die communication system, comprising:
a first transmitting device disposed at a first die for transmitting a first data unit stream to a data channel in a communication interface; and
a first receiving device disposed at a second die, wherein the first die and the second die are disposed in a same integrated circuit package, the first receiving device is coupled to the first transmitting device via the communication interface, the first receiving device receives the first data unit stream from the data channel in the communication interface, the first receiving device returns transmission management information to the first transmitting device via a feedback channel different from the data channel in the communication interface, the feedback channel comprises a first dedicated wire, and the first transmitting device manages the first data unit stream of the data channel based on the transmission management information of the first dedicated wire,
wherein the first dedicated wire is dedicated to reflect a full state of a data buffer of the first receiving device, and when the data buffer of the first receiving device is full, the first receiving device informs the first transmitting device to suspend a transmission of the first data unit stream via the first dedicated wire.