US 12,292,693 B2
Data inspection for digital lithography for HVM using offline and inline approach
Chung-Shin Kang, San Jose, CA (US); Jun Yang, San Jose, CA (US); and Hongbin Ji, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 17, 2024, as Appl. No. 18/415,430.
Application 18/415,430 is a continuation of application No. 17/792,667, granted, now 11,914,305, previously published as PCT/US2020/018546, filed on Feb. 18, 2020.
Prior Publication US 2024/0152061 A1, May 9, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/70508 (2013.01) [G03F 7/70291 (2013.01); G03F 7/704 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for data inspection in a lithographic system, the method comprising:
optimizing a first bitmap to create a second bitmap;
comparing the first bitmap to the second bitmap;
processing the second bitmap with a rasterizer to create a third bitmap;
creating a first data block from the second bitmap and a second data block from the third bitmap; and
comparing the first data block and second data block with a processor.