| CPC G03F 7/0002 (2013.01) | 11 Claims |
|
1. A method for producing micro- and/or nanostructures, comprising:
a) fixing a substrate on a substrate accommodating device, the substrate having an embossing material thereon,
b) contacting a structured stamp with the embossing material to structure the embossing material,
c) at least partially cancelling the fixing of the substrate on the substrate accommodating device,
d) curing the embossing material on the substrate after the at least partially cancelling of the fixing of the substrate and while the structured stamp is in contact with the embossing material, and
f) removing the cured embossing material from the structured stamp,
wherein the substrate is flexible and adaptable to be at least partially conformal with the structured stamp after the at least partial cancelling of the fixing,
wherein, after the at least partial cancelling of the fixing of the substrate, the substrate is at least partially detached from the substrate accommodating device by moving the substrate accommodating device relative to the substrate and/or moving the substrate accommodating device relative to a stamp accommodating device and/or using capillary forces,
wherein the embossing material is structured without pressure and/or without contact pressure by capillary forces,
wherein the substrate with the embossing material is fixed on the substrate accommodating device by means of at least one controllable fixing element arranged in the substrate accommodating device, and the fixing is cancelled by the at least one controllable fixing element, and
wherein the fixing of the substrate and the at least partial cancelling of the fixing of the substrate is controlled by controlling the at least one controllable fixing element, so that the structuring of the embossing material and/or the detachment of the substrate after the contacting of the structured stamp with the embossing material takes place at a specific time.
|