CPC G03B 21/16 (2013.01) [H05K 7/20336 (2013.01); H05K 7/2039 (2013.01)] | 20 Claims |
1. A heat-dissipating module, wherein the heat-dissipating module comprises a plurality of heat-dissipating fins and a plurality of heat pipes, wherein
the heat-dissipating fins comprise a plurality of first heat-dissipating fins and a plurality of second heat-dissipating fins, and the first heat-dissipating fins and the second heat-dissipating fins are disposed in an interleaved manner and are spaced apart from each other and arranged in parallel along a first direction;
each of the first heat-dissipating fins has a plurality of first vias and a plurality of first breach holes, and the first vias and the first breach holes are arranged in an interleaved manner, wherein the first breach holes are arranged along a second direction, and the first direction is not parallel to the second direction;
each of the second heat-dissipating fins has a plurality of second vias and a plurality of second breach holes, and the second vias and the second breach holes are arranged in an interleaved manner, wherein the second breach holes are arranged along the second direction, and the second vias respectively correspond to the first vias of the first heat-dissipating fins;
the heat pipes are configured to pass through the first vias of the first heat-dissipating fins and the second vias of the second heat-dissipating fins along the first direction; and
any of the first breach holes forms an orthogonal projection on the second heat-dissipating fins along the first direction, and a position of the orthogonal projection and a position of the corresponding second breach hole in the second breach holes are not overlapped or are partially overlapped, and are arranged in symmetry.
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