CPC G02F 1/1345 (2013.01) [G02F 1/13452 (2013.01); G02F 1/13456 (2021.01); H05K 3/103 (2013.01); H05K 3/361 (2013.01); H05K 2203/0278 (2013.01)] | 4 Claims |
1. A manufacturing method of an electronic component, the method comprising:
preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate;
preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate; and
curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member,
wherein at least one of the first electrode and the second electrode includes a window portion, and in the curing, the bonding member is cured by irradiating the bonding member with light through the window portion,
wherein the bonding member includes:
a first portion arranged in a first region not sandwiched between the first electrode and the second electrode; and
a second portion arranged in a second region sandwiched between the first electrode and the second electrode, and
wherein the curing includes:
curing the first portion after a fluidity of the first portion is increased by selectively irradiating the first portion with the light; and
curing the second portion after a fluidity of the second portion is increased by selectively irradiating, with the light through the window portion, a portion of the second portion where the window portion exists, after the curing of the first portion.
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