CPC G02F 1/133311 (2021.01) [H10K 50/8426 (2023.02); H10K 50/844 (2023.02); H10K 59/131 (2023.02); H10K 59/8722 (2023.02); H10K 59/873 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] | 20 Claims |
1. A display panel, comprising:
a base substrate having a main surface, wherein the main surface comprises a display region and a border region surrounding the display region, the border region comprises a peripheral circuit region, and a peripheral circuit is provided in the peripheral circuit region;
a planarization layer, comprising a part in the display region and a part in the border region;
a light-emitting device, in the display region and on a side, away from the base substrate, of the planarization layer; and
a pixel circuit, in the display region and configured to control light emitting state of the light-emitting device;
a barrier structure, wherein at least a part of the barrier structure is in the peripheral circuit region on the base substrate, and the barrier structure comprises an organic barrier layer and an inorganic barrier layer covering the organic barrier layer;
an encapsulation substrate on a side, away from the base substrate, of the barrier structure;
a frame sealant, in the peripheral region and respectively connected with the base substrate and the encapsulation substrate; and
an encapsulation sealant, which is at least in the peripheral circuit region;
the display panel further comprises:
an encapsulation layer, covering and sealing the display region and at least part of the border region, wherein
both the encapsulation layer and the inorganic barrier layer extend from the display region to the border region, and both a part of the encapsulation layer that overlaps with the organic barrier layer in the direction perpendicular to the main surface of the base substrate and a part of the encapsulation layer that does not overlap with the organic barrier layer in the direction perpendicular to the main surface of the base substrate are in contact with the inorganic barrier layer; the encapsulation sealant is between the encapsulation layer and the encapsulation substrate, and covers the encapsulation layer.
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