| CPC G02B 6/4281 (2013.01) [G02B 6/3885 (2013.01); G02B 6/389 (2013.01); G02B 6/43 (2013.01); G02B 6/1203 (2013.01); G02B 6/387 (2013.01)] | 14 Claims |

|
1. An optical module, comprising:
a circuit board;
a circuit adapter board disposed on the circuit board and electrically connected to the circuit board, a thermal expansion coefficient of the circuit adapter board being lower than that of the circuit board;
a silicon optical chip disposed on the circuit adapter board and electrically connected to the circuit adapter board;
an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon; and
a light source disposed on the circuit board, and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon, wherein
the silicon optical chip comprises optical waveguide end facets disposed on a side of the silicon optical chip, the optical waveguide end facets being configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon;
the circuit adapter board comprises a notch located on a side of the circuit adapter board proximate to the optical waveguide end facets.
|