US 12,292,607 B2
Optical package
Deborah Cogoni, Notre Dame de l'Osier (FR); Raphael Goubot, Grenoble (FR); and Younes Boutaleb, Grenoble (FR)
Assigned to STMicroelectronics (Alps) SAS, Grenoble (FR); and STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed by STMicroelectrnoics (Alps) SAS, Grenoble (FR); and STMicroelectronics (Grenoble 2) SAS, Grenoble (FR)
Filed on May 3, 2022, as Appl. No. 17/735,653.
Claims priority of application No. 2104849 (FR), filed on May 7, 2021.
Prior Publication US 2022/0357536 A1, Nov. 10, 2022
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01)
CPC G02B 6/4272 (2013.01) [G02B 6/4274 (2013.01); G02B 6/43 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An optical package, comprising:
a substrate of a first material having an upper surface and a lower surface and comprising electrical connection vias extending through the substrate;
an electronic integrated circuit chip having a lower surface assembled on the upper surface of the substrate, and an upper surface;
an optical sensor integrated in the electronic integrated circuit chip or assembled on the upper surface of the electronic integrated circuit chip;
the substrate comprising a plurality of cavities opening onto at least the upper surface of said substrate, each cavity of said plurality of cavities being filled with a second material, said second material having a thermal conductivity greater than the thermal conductivity of the first material, the electronic integrated circuit chip being positioned on the substrate so as to cover said plurality of cavities;
wherein said electrical connection vias comprise first electrical connection vias arranged on either side of the plurality of cavities and second electrical connection vias arranged between two cavities of the plurality of cavities.