US 12,292,601 B2
Bus distribution using multiwavelength multiplexing
Mark D. Kellam, Siler City, NC (US); Dongyun Lee, Sunnyvale, CA (US); Thomas Vogelsang, Mountain View, CA (US); and Steven C. Woo, Saratoga, CA (US)
Assigned to Rambus inc., San Jose, CA (US)
Filed by Rambus Inc., San Jose, CA (US)
Filed on Oct. 10, 2022, as Appl. No. 17/963,065.
Claims priority of provisional application 63/271,835, filed on Oct. 26, 2021.
Prior Publication US 2023/0125262 A1, Apr. 27, 2023
Int. Cl. G02B 6/293 (2006.01); G02B 6/12 (2006.01); H04B 10/50 (2013.01)
CPC G02B 6/2938 (2013.01) [G02B 6/12007 (2013.01); H04B 10/506 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module, comprising:
a first buffer die including a first silicon waveguide to receive a first light wave carrier and a second light wave carrier, the first buffer die to couple the first light wave carrier to a first optical to electrical interface;
a second buffer die including a second silicon waveguide to receive the second light wave carrier, the second buffer die to couple the second light wave carrier to a second optical to electrical interface;
a first optical interface to receive the first light wave carrier, carrying first command/address information, from a host system into a first polymer waveguide disposed on the module, and to receive the second light wave carrier, also carrying the first command/address information, from the host system into the first polymer waveguide; and,
the first polymer waveguide to couple the first light wave carrier and the second light wave carrier into the first silicon waveguide, and to receive the second light wave carrier back from the first silicon waveguide, and to couple the second light wave carrier into the second silicon waveguide.