US 12,292,368 B2
Evaluation method, substrate processing apparatus, manufacturing method of substrate processing apparatus and article manufacturing method
Masami Yonekawa, Tochigi (JP); Hisanobu Azuma, Tochigi (JP); and Toshihiro Ifuku, Tochigi (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 28, 2022, as Appl. No. 17/732,342.
Claims priority of application No. 2021-081199 (JP), filed on May 12, 2021.
Prior Publication US 2022/0364972 A1, Nov. 17, 2022
Int. Cl. G01N 15/06 (2024.01); G03F 7/00 (2006.01); H01L 21/66 (2006.01)
CPC G01N 15/0606 (2013.01) [G03F 7/70608 (2013.01); H01L 22/10 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An evaluation method for evaluating a state in an apparatus concerning particles existing inside a substrate processing apparatus for processing a substrate, comprising:
arranging a plate in a charged state inside the apparatus and obtaining the number of particles adhered to the plate by performing a dummy operation different from an operation of processing the substrate; and
evaluating the state in the apparatus based on a coefficient representing a ratio of the number of particles adhered to the plate by performing the dummy operation for the plate in an uncharged state to the number of particles adhered to the plate in the charged state, and the number of particles obtained in the arranging the plate.