US 12,292,348 B2
Electronic device
Yueh-Kang Lee, Taichung (TW); Jia Yin Wu, Taichung (TW); and Yung-Hsiang Chang, Taichung (TW)
Assigned to Merry Electronics(Shezhen) Co., Ltd., ShenZhen (CN)
Filed by Merry Electronics(Shenzhen) Co., Ltd., ShenZhen (CN)
Filed on Feb. 6, 2023, as Appl. No. 18/165,260.
Application 18/165,260 is a continuation in part of application No. 17/557,050, filed on Dec. 21, 2021, granted, now 11,952,264.
Claims priority of application No. 110138951 (TW), filed on Oct. 20, 2021; and application No. 111137251 (TW), filed on Sep. 30, 2022.
Prior Publication US 2023/0175910 A1, Jun. 8, 2023
Int. Cl. H04R 19/04 (2006.01); B81B 3/00 (2006.01); G01L 19/06 (2006.01)
CPC G01L 19/0609 (2013.01) [B81B 3/0051 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate, having a bearing surface;
a sensor, disposed on the bearing surface;
a pressurizing component, disposed on the sensor;
a stopping structure, disposed between the pressurizing component and the sensor, wherein the stopping structure has an upper surface and a lower surface that are opposite to each other and a plurality of openings, and each of the openings penetrate from the upper surface to the lower surface; and
a first adhesive layer, disposed on the upper surface of the stopping structure to cover a portion of the openings.