US 12,292,343 B2
Systems and methods for foldable multi-mode bend sensors
Colton A. Ottley, Farmington, UT (US); Jared K. Jonas, Seattle, WA (US); Colin D. Eichinger, Salt Lake City, UT (US); Nathan Grimes, Bountiful, UT (US); and Nathan C. Briggs, Ogden, UT (US)
Assigned to Nitto Bend Technologies, Inc., Farmington, UT (US)
Filed by Nitto Bend Technologies, Inc., Farmington, UT (US); and Nitto Denko Corporation, Osaka (JP)
Filed on Nov. 14, 2023, as Appl. No. 18/389,381.
Application 18/389,381 is a continuation of application No. 17/534,297, filed on Nov. 23, 2021, granted, now 11,852,546.
Claims priority of provisional application 63/118,561, filed on Nov. 25, 2020.
Prior Publication US 2024/0085251 A1, Mar. 14, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 1/14 (2006.01)
CPC G01L 1/142 (2013.01) 17 Claims
OG exemplary drawing
 
1. A multi-mode compliant sensor comprising:
a signal electrode layer comprising:
an elastomeric layer;
a first sensor region within the elastomeric layer and comprising conductive material;
a narrowed region connected to the elastomeric layer and comprising a fold line region; and
a foldable sensor region connected to the narrowed region and comprising conductive material;
wherein the narrowed region is folded at the fold line region and the foldable sensor region is positioned above the first sensor region;
a dielectric interposer positioned between the first sensor region and the foldable sensor region, the combination forming a first compliant capacitor;
a control circuit comprising:
a microcontroller configured to operate as an instrumentation amplifier with programmable gain; and
a first resistor;
wherein the first resistor converts a current charging the first compliant capacitor into voltage, and the instrumentation amplifier converts the differential signal into a single ended voltage output.