US 12,292,215 B2
Heat pump assembly
Boguslaw Strzalka, Nysa (PL); and Dariusz Sapija, Jelcz Laskowice (PL)
Assigned to B/E AEROSPACE, INC., Winston-Salem, NC (US)
Filed by B/E Aerospace, Inc., Winston Salem, NC (US)
Filed on Aug. 23, 2022, as Appl. No. 17/893,352.
Claims priority of application No. 21461578 (EP), filed on Aug. 23, 2021.
Prior Publication US 2023/0056167 A1, Feb. 23, 2023
Int. Cl. F25B 21/04 (2006.01)
CPC F25B 21/04 (2013.01) 11 Claims
OG exemplary drawing
 
1. A heat pump assembly comprising:
a plurality of Peltier devices mounted to receive air from a common air inlet;
means for causing a current to flow through the Peltier devices;
a plurality of first heat sinks arranged in thermal contact with a first, hot, side of the Peltier devices; and
a plurality of second heat sinks arranged in thermal contact with a second, cold, side of the Peltier devices;
wherein each of the first heat sinks defines a respective first channel through which inlet air warmed by the hot side of the Peltier devices flows; and
wherein each of the second heat sinks defines a respective second channel through which inlet air cooled by the cold side of the Peltier devices flows;
wherein the Peltier devices include four Peltier devices, and wherein the first heat sinks define a cross, each of the four arms defined by a heat sink and extending outwards from the inlet, and each Peltier device is located below and in thermal contact with a respective arm;
wherein the second heat sinks are in the form of L-shaped conduits, each second heat sink located between two adjacent arms of the cross of the first heat sinks.