US 12,291,780 B2
Tray and substrate fixing device
Norio Shiraiwa, Nagano (JP); and Kazuya Takada, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Nov. 10, 2023, as Appl. No. 18/506,662.
Claims priority of application No. 2022-181706 (JP), filed on Nov. 14, 2022.
Prior Publication US 2024/0158916 A1, May 16, 2024
Int. Cl. H01L 21/683 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01)
CPC C23C 16/4581 (2013.01) [C23C 16/4583 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A tray mounted on an electrostatic chuck, the tray comprising:
an accommodation recess configured to accommodate a substrate;
a bottom plate portion placed on the electrostatic chuck;
a coating film layer made of a material different from the bottom plate portion and formed on an upper surface of the bottom plate portion; and
an opening portion penetrating the coating film layer in a thickness direction,
wherein the accommodation recess includes an inner side surface of the opening portion and an upper surface of the bottom plate portion exposed from the opening portion,
wherein the coating film layer has a multilayer structure including a first coating film having higher plasma resistance than the bottom plate portion and a second coating film laminated on an upper surface of the first coating film and having higher plasma resistance than the first coating film, and
wherein the first coating film is thicker than the second coating film.