US 12,291,604 B2
Curable resin composition, dry film and cured product thereof, and electronic component including cured product
Chihiro Funakoshi, Hiki-gun (JP); and Yoko Shibasaki, Hiki-gun (JP)
Assigned to TAIYO HOLDINGS CO., LTD., Hiki-gun (JP)
Appl. No. 17/639,153
Filed by TAIYO HOLDINGS CO., LTD., Saitama (JP)
PCT Filed Aug. 28, 2020, PCT No. PCT/JP2020/032716
§ 371(c)(1), (2) Date Feb. 28, 2022,
PCT Pub. No. WO2021/044984, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-162824 (JP), filed on Sep. 6, 2019; and application No. 2019-162827 (JP), filed on Sep. 6, 2019.
Prior Publication US 2022/0315704 A1, Oct. 6, 2022
Int. Cl. C08F 2/46 (2006.01); C08F 2/48 (2006.01); C08F 2/50 (2006.01); C08F 222/10 (2006.01); C08F 283/04 (2006.01); C08G 61/04 (2006.01); C08G 73/10 (2006.01); C08G 73/14 (2006.01); C08J 5/18 (2006.01); C08L 63/04 (2006.01)
CPC C08G 73/14 (2013.01) [C08F 2/48 (2013.01); C08F 222/103 (2020.02); C08F 283/04 (2013.01); C08G 73/1003 (2013.01); C08J 5/18 (2013.01); C08L 63/04 (2013.01); C08L 2201/08 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01)] 20 Claims
 
1. A curable resin composition, comprising:
an amide-imide resin;
a compound having an ethylenic double bond;
a photopolymerization initiator; and
a carboxyl group-containing resin having no amide-imide structures such that the carboxyl group-containing resin has a structure that is different from a structure of the amide-imide resin,
wherein the amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight in a range of 500 to 1000, and the carboxyl group-containing resin has a content in a range of 50 parts by mass to 100 parts by mass with respect to 100 parts by mass of the amide-imide resin.