US 12,291,445 B2
Dual diaphragm dielectric sensor
Peter V. Loeppert, Durand, IL (US); and Michael Pedersen, Long Grove, IL (US)
Assigned to Knowles Electronics, LLC, Itasca, IL (US)
Filed by Knowles Electronics, LLC, Itasca, IL (US)
Filed on Mar. 16, 2022, as Appl. No. 17/696,370.
Prior Publication US 2023/0294977 A1, Sep. 21, 2023
Int. Cl. B81B 3/00 (2006.01)
CPC B81B 3/0086 (2013.01) [B81B 2201/0221 (2013.01); B81B 2203/0127 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectromechanical systems (MEMS) die, comprising:
a first diaphragm;
a second diaphragm;
a first plurality of electrodes, each of the first plurality disposed on the first diaphragm;
a second plurality of electrodes, each of the second plurality disposed on the second diaphragm;
a fixed dielectric element disposed between the first and second diaphragms and including a plurality of apertures; and
a third plurality of electrodes, each of the third plurality comprising
a first conductive layer disposed on the first diaphragm proximate to at least one of the first plurality and
a second conductive layer disposed on the second diaphragm proximate to at least one of the second plurality, and
a conductive pin that extends through an aperture of the plurality of apertures and electrically connects the first conductive layer to the second conductive layer,
wherein the MEMS die generates one or more signals based on a change in capacitance resulting from movement of the first and second diaphragms relative to the fixed dielectric element.