US 12,291,079 B2
Connection apparatus, manufacturing method for connection device, and thermal management component
Keli Ye, Zhejiang (CN); and Linzhong Wu, Zhejiang (CN)
Assigned to ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD., Zhejiang (CN)
Appl. No. 18/268,231
Filed by ZHEJIANG SANHUA AUTOMOTIVE COMPONENTS CO., LTD., Zhejiang (CN)
PCT Filed Dec. 22, 2021, PCT No. PCT/CN2021/140436
§ 371(c)(1), (2) Date Jun. 18, 2023,
PCT Pub. No. WO2022/135465, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 202011539509.5 (CN), filed on Dec. 23, 2020.
Prior Publication US 2024/0262160 A1, Aug. 8, 2024
Int. Cl. B60H 1/00 (2006.01); B60H 1/32 (2006.01); F28F 9/18 (2006.01)
CPC B60H 1/00485 (2013.01) [B60H 1/3229 (2013.01); F28F 9/18 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A communication device, applicable to a thermal management assembly, wherein
the communication device comprises two or more plate bodies, adjacent plate bodies of the plate bodies are secured to each other and connected in a sealed manner, the communication device is provided with a channel, at least one channel portion is provided inside at least one of the adjacent plate bodies of the plate bodies, and at least part of the channel is formed at the channel portion by the adjacent plate bodies; wherein
in an axial direction or a radial direction of the communication device, one of side walls of at least one of the plate bodies is provided with at least one mounting portion and/or at least one communication portion, the mounting portion is provided with a mounting hole, the thermal management assembly comprises a valve device for controlling a flow rate or blocking/unblocking of the channel, the mounting hole is configured to accommodate at least part of the valve device, the channel is in communication with the mounting hole of the at least one mounting portion; and wherein
the communication portion is provided with a communication hole, the thermal management assembly further comprises at least one thermal management unit, the communication hole is configured to be in communication with one of an inlet or an outlet of the at least one thermal management unit, and the channel is in communication with the at least one communication hole.