US 12,291,029 B2
Apparatus and method for processing substrate
Sung Ho Kim, Chungcheongnam-do (KR); Bo Yeon Hwang, Chungcheongnam-do (KR); Chang Jin Moon, Seoul (KR); Sol Min Park, Chungcheongnam-do (KR); and Sang Seok Kim, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Sep. 15, 2022, as Appl. No. 17/945,089.
Claims priority of application No. 10-2021-0193150 (KR), filed on Dec. 30, 2021; and application No. 10-2022-0014342 (KR), filed on Feb. 3, 2022.
Prior Publication US 2023/0211601 A1, Jul. 6, 2023
Int. Cl. B41J 2/04 (2006.01); B41J 2/045 (2006.01); B41M 3/00 (2006.01); B41M 5/00 (2006.01)
CPC B41J 2/04556 (2013.01) [B41J 2/04581 (2013.01); B41M 3/006 (2013.01); B41M 5/0047 (2013.01); B41M 5/007 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for processing a substrate, comprising:
levitating the substrate on a levitation stage at a levitation amount;
measuring, using one or more sensors of an inkjet head module disposed on the levitation stage, a distance between the substrate and the inkjet head module;
controlling the inkjet head module to discharge ink onto the substrate at an ink discharging speed based on the measured distance to automatically adjust for the levitation amount of the substrate; and
further controlling the inkjet head module to actively adjust a volume of the ink being discharged by the inkjet head module to discharge the ink onto the substrate at an ink discharge amount that corresponds to the ink discharging speed.