US 12,290,897 B2
Fluid-tight electrical connection techniques for semiconductor processing
Chad Pollard, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); and Haosheng Wu, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 26, 2022, as Appl. No. 17/974,281.
Claims priority of provisional application 63/346,811, filed on May 27, 2022.
Prior Publication US 2023/0387625 A1, Nov. 30, 2023
Int. Cl. F16L 11/127 (2006.01); B24B 53/017 (2012.01); B24B 57/02 (2006.01); H01L 21/67 (2006.01); H01R 13/52 (2006.01); H01R 13/622 (2006.01)
CPC B24B 57/02 (2013.01) [B24B 53/017 (2013.01); F16L 11/127 (2013.01); H01L 21/67017 (2013.01); H01R 13/5205 (2013.01); H01R 13/622 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An assembly for electrical connection to a volume having a fluid, comprising:
a wall that forms a boundary of the volume to contain the fluid;
a conductive wire extending through the volume;
an extraction fitting providing a sealed electrical connection through the wall, wherein the extraction fitting includes an annular plastic body having a passage therethrough, the plastic body has a threaded outer surface that is screwed into a threaded aperture in the wall, the conductive wire is inserted into one end of the passage, and a conductive lug is inserted into an opposite end of the passage and contacts the conductive wire, and the conductive lug has a threaded outer surface that is screwed into a threaded portion at the opposite end of the passage.