US 12,290,896 B2
Apparatus and method for CMP temperature control
Shou-Sung Chang, Mountain View, CA (US); Hari Soundararajan, Sunnyvale, CA (US); Haosheng Wu, San Jose, CA (US); and Jianshe Tang, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 19, 2020, as Appl. No. 16/795,103.
Claims priority of provisional application 62/808,266, filed on Feb. 20, 2019.
Prior Publication US 2020/0262024 A1, Aug. 20, 2020
Int. Cl. B24B 37/015 (2012.01)
CPC B24B 37/015 (2013.01) 12 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing apparatus comprising:
a platen to hold a polishing pad;
a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
a polishing liquid dispenser including a port arranged on a polishing liquid arm extending over the platen to deliver polishing liquid onto a first region of the polishing pad;
a temperature control system including a temperature control arm extending over the platen, a source of coolant fluid and a plurality of openings positioned on the temperature control arm over the platen, one or more valves, one or more pumps, or both, to control a mix ratio of a cooling liquid and a gas in the coolant fluid, wherein the plurality of openings are separated from the polishing pad and configured for the coolant fluid to flow directly from the plurality of openings onto a different second region of the polishing pad; and
a rinse system configured to deliver a rinsing liquid to a different third region of the polishing pad.