US 12,290,883 B2
Bonding wire
Daizo Oda, Saitama (JP); Motoki Eto, Saitama (JP); and Ryo Oishi, Saitama (JP)
Assigned to NIPPON MICROMETAL CORPORATION, Saitama (JP)
Appl. No. 18/855,536
Filed by NIPPON MICROMETAL CORPORATION, Saitama (JP)
PCT Filed Jun. 27, 2023, PCT No. PCT/JP2023/023777
§ 371(c)(1), (2) Date Oct. 9, 2024,
PCT Pub. No. WO2024/247286, PCT Pub. Date Dec. 5, 2024.
Claims priority of application No. 2023-088808 (JP), filed on May 30, 2023.
Prior Publication US 2025/0114877 A1, Apr. 10, 2025
Int. Cl. B23K 35/02 (2006.01); B23K 20/00 (2006.01); B23K 35/30 (2006.01); B23K 101/40 (2006.01)
CPC B23K 35/0261 (2013.01) [B23K 35/302 (2013.01); B23K 20/004 (2013.01); B23K 2101/40 (2018.08)] 16 Claims
OG exemplary drawing
 
1. A bonding wire comprising:
a core material of Cu or Cu alloy; and
a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material, wherein
in a concentration profile in a depth direction of the bonding wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer,
a thickness of the coating layer is 10 nm or more and 130 nm or less,
an average value X is 0.1 or more and 35.0 or less where X is defined as an average value of a ratio of a Pd concentration CPd (atomic %) to an Ni concentration CNi (atomic %), CPd/CNi, for all measurement points in the coating layer,
a total number of measurement points in the coating layer whose absolute deviation from the average value X is 0.3X or less is 50% or more relative to a total number of measurement points in the coating layer, and
the bonding wire satisfies the following condition (A):
(A) the bonding wire contains one or more elements (hereinafter referred to as a “first additive element”) selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Zn, Zr, Nb, Mo, Ru, Rh, Sn, Ta, W, Os, Ir, Pt, Au and Bi, and a total concentration of the first additive element relative to the entire bonding wire is 5 ppm by mass or more and 450 ppm by mass or less.