	US 12,290,876 B2
	Film removing method, substrate treating method, and substrate treating apparatus
Soo Young Park, Incheon (KR); Ohyeol Kwon, Cheonan-si (KR); Jun Keon Ahn, Sejong-si (KR); Jung Hwan Lee, Pyeongtaek-si (KR); and Seong Soo Lee, Suwon-si (KR)
Assigned to Semes Co., Ltd., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jun. 27, 2023, as Appl. No. 18/341,838.
Application 18/341,838 is a continuation of application No. 16/862,162, filed on Apr. 29, 2020, abandoned.
Claims priority of application No. 10-2019-0050471 (KR), filed on Apr. 30, 2019.
Prior Publication US 2023/0330768 A1, Oct. 19, 2023
Int. Cl. B23K 26/0622 (2014.01); B23K 26/08 (2014.01); B23K 26/10 (2006.01); B23K 26/40 (2014.01); B23K 103/00 (2006.01)

CPC B23K 26/0622 (2015.10) [B23K 26/0823 (2013.01); B23K 26/40 (2013.01); B23K 26/103 (2013.01); B23K 2103/50 (2018.08)]

15 Claims

1. A method for removing a film from a substrate by irradiating a plurality of unit pulse laser beams to an edge region of the substrate, the method comprising:

a first irradiation operation for irradiating the plurality of unit pulse laser beams onto first regions the substrate while the substrate is rotating; and

a second irradiation operation for irradiating the plurality of unit pulse laser beams to second regions of the substrate onto which the unit pulse laser beams are not irradiated in the first irradiation operation,

wherein the first irradiation operation irradiates the first regions with the unit pulse laser beams at one or more first operation radial distances along a circumference of the substrate such that each of the first regions do not overlap.