US 12,290,837 B2
Radiation and high-temperature tolerant piezoelectric ultrasonic contact transducer with mounting assembly
Dan Xiang, Gaithersburg, MD (US); and Uday Singh, Gaithersburg, MD (US)
Assigned to X-Wave Innovations, Inc.
Filed by X-Wave Innovations, Inc., Gaithersburg, MD (US)
Filed on Apr. 21, 2022, as Appl. No. 17/726,489.
Application 17/726,489 is a continuation in part of application No. 16/528,581, filed on Jul. 31, 2019, granted, now 11,620,973.
Prior Publication US 2022/0241819 A1, Aug. 4, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B06B 1/06 (2006.01); G01H 11/08 (2006.01); G10K 11/00 (2006.01); G10K 11/36 (2006.01)
CPC B06B 1/0651 (2013.01) 10 Claims
OG exemplary drawing
 
1. An ultrasonic transducer comprising:
a backing comprising a central indented cone portion, a central flanged portion, and a bottom portion below an indented cone portion including a front face of the bottom portion positioned perpendicular to a center axis of a cone portion, and a hole formed along a lateral axis from an outer wall of the backing and extending partially into a backing wall, wherein the front face of the bottom portion is configured to receive a piezoelectric element;
a top enclosure that can partially receive the backing, wherein the top enclosure includes a through-hole through the center axis;
a bottom enclosure, that can partially receive the backing;
a set screw configured to be received through the top enclosure through-hole; and
a ball configured to be received into at least a part of the cone portion,
wherein, the top enclosure and bottom enclosure are each configured to fix against the backing central flanged portion, and when fixed, the set can make contact with the ball.