US 12,290,693 B2
Feedthrough header assembly and device including same
Mark E. Henschel, Phoenix, AZ (US); Andrew J. Ries, Lino Lakes, MN (US); Songhua Shi, Tempe, AZ (US); Jemmy Sutanto, Scottsdale, AZ (US); and Lea Ann Nygren, Bloomington, MN (US)
Assigned to Medtronic, Inc., Minneapolis, MN (US)
Filed by Medtronic, Inc., Minneapolis, MN (US)
Filed on Jan. 28, 2022, as Appl. No. 17/587,676.
Claims priority of provisional application 63/143,996, filed on Feb. 1, 2021.
Prior Publication US 2022/0241598 A1, Aug. 4, 2022
Int. Cl. A61N 1/375 (2006.01); H01R 12/52 (2011.01); H01R 43/20 (2006.01)
CPC A61N 1/3754 (2013.01) [A61N 1/3758 (2013.01); H01R 12/52 (2013.01); H01R 43/205 (2013.01); A61N 1/37512 (2017.08)] 20 Claims
OG exemplary drawing
 
1. An electronics module comprising:
a feedthrough header assembly comprising:
a conductive header comprising a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the conductive header; and
a feedthrough pin disposed within a via that extends through the conductive header between the inner surface and the outer surface of the conductor header, wherein the feedthrough pin is electrically isolated from the conductive header and comprises a first end adjacent to the inner surface of the conductive header and a second end adjacent to the outer surface of the conductive header; and
an electronic layer comprising a substrate and an electronic component disposed on or within the substrate, wherein the electronic component is electrically connected to the contact of the conductive header so that the electronic component is electrically connected to the conductive header, and further wherein a major surface of the substrate of the electronic layer faces the conductive inner surface of the conductive header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the conductive header so that a gap is formed between the electronic layer and the conductive header.