US 12,290,384 B2
Two-layer adhesion of electronics to a surface
Leanna Pancoast, White Plains, NY (US); and Katsuyuki Sakuma, Fishkill, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Aug. 30, 2022, as Appl. No. 17/823,168.
Application 17/823,168 is a division of application No. 16/665,254, filed on Oct. 28, 2019, granted, now 11,471,105.
Prior Publication US 2022/0409136 A1, Dec. 29, 2022
Int. Cl. A61B 5/257 (2021.01); A61B 5/00 (2006.01); A61L 31/06 (2006.01); A61L 31/14 (2006.01); C09J 5/06 (2006.01); C09J 7/10 (2018.01)
CPC A61B 5/6832 (2013.01) [A61B 5/682 (2013.01); A61B 5/6826 (2013.01); A61L 31/06 (2013.01); A61L 31/141 (2013.01); C09J 5/06 (2013.01); C09J 7/10 (2018.01); A61B 2503/40 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for removing an electronic device from an organism, the method comprising:
forming an adhesive stack on a surface of the organism, the adhesive stack comprising a bottom layer positioned between a top layer and the surface of the organism, the electronic device embedded in the top layer, wherein the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration;
exposing the adhesive stack to the first solvent for the first duration to release the adhesive stack from the surface of the organism; and
removing the adhesive stack from the organism.