CPC H10K 77/111 (2023.02) [H10K 71/00 (2023.02)] | 19 Claims |
1. A support structure, comprising a metal substrate, and a buffer layer provided on the metal substrate, wherein
the support structure comprises a bending region and a non-bending region, a portion of the metal substrate located in the bending region has a first recess so that a thickness of the portion of the metal substrate located in the bending region having the first recess is smaller than a thickness of a portion of the metal substrate located in the non-bending region;
the portion of the metal substrate located in the non-bending region has a second recess, and a section of the second recess has a stepped shape in a direction perpendicular to the metal substrate; and
the buffer layer is provided on a side of the metal substrate having the first recess and the second recess, and is at least located in the first recess and the second recess.
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