US 11,974,405 B2
Electronic device housing and electronic device including the same
Youngmin Moon, Suwon-si (KR); Jaehyun Bae, Suwon-si (KR); and Hyunsuk Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 17, 2022, as Appl. No. 17/889,898.
Application 17/889,898 is a continuation of application No. PCT/KR2022/009746, filed on Jul. 6, 2022.
Claims priority of application No. 10-2021-0114685 (KR), filed on Aug. 30, 2021.
Prior Publication US 2023/0065427 A1, Mar. 2, 2023
Int. Cl. H05K 5/02 (2006.01); B32B 1/00 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 5/02 (2006.01); B32B 7/022 (2019.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/28 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01)
CPC H05K 5/02 (2013.01) [B32B 1/00 (2013.01); B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 5/02 (2013.01); B32B 7/022 (2019.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 17/067 (2013.01); B32B 17/10 (2013.01); B32B 27/283 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 38/0036 (2013.01); B32B 2038/0048 (2013.01); B32B 2250/03 (2013.01); B32B 2255/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2262/105 (2013.01); B32B 2307/306 (2013.01); B32B 2307/51 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2307/734 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic device housing comprising:
a substrate comprising glass;
an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed;
the insert portion comprising a surface facing the substrate and at which the insert portion is bonded to the substrate; and
an elastic layer which is between the substrate and the surface of the insert portion and extends along the surface of the insert portion, wherein a difference between a coefficient of expansion of the substrate and a coefficient of expansion of the insert portion is greater than or equal to about 10×10−6 m/(m° C.).