CPC H02N 1/006 (2013.01) [G01Q 60/16 (2013.01)] | 8 Claims |
1. A microelectromechanical (MEMS) device comprising:
a substrate; and
a movable structure flexurally connected to the substrate, capable of moving in relation to the substrate; wherein the movable structure further comprising:
a tip segment comprising a STM tip configured to establish a tunneling current; and
an actuation segment mechanically connected to the tip segment by an oxide bridge, wherein the actuation segment is configured to move the movable structure, wherein the oxide bridge provides electrical isolation between the tip segment and the actuation segment, and wherein the tip segment, the actuation segment and the oxide bridge share a device layer of a single SOI wafer.
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