US 11,973,009 B2
Lead frame assembly for a semiconductor device
Ricardo Lagmay Yandoc, Nijmegen (NL); Dave Anderson, Nijmegen (NL); and Adam Richard Brown, Nijmegen (NL)
Assigned to Nexperia B.V., Nijmegen (NL)
Filed by NEXPERIA B.V., Nijmegen (NL)
Filed on Jul. 2, 2020, as Appl. No. 16/919,426.
Claims priority of application No. 19184250 (EP), filed on Jul. 3, 2019.
Prior Publication US 2021/0005538 A1, Jan. 7, 2021
Int. Cl. H01L 23/495 (2006.01)
CPC H01L 23/49524 (2013.01) [H01L 23/49555 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A lead frame assembly for a semiconductor device, the lead frame assembly comprising:
a die attach structure and a clip frame structure, wherein the clip frame structure further comprises:
a die connection portion configured to contact a source contact terminal on a top side of a semiconductor die; and
a merged lead portion having a continuous width along the die connection portion, wherein the merged lead portion does not divide into a plurality of finger-like lead members extending away from the die connection portion, wherein the merged lead portion is integrally formed with the die connection portion, and wherein the merged lead portion further comprises one or more bends therein configured and arranged to allow the merged lead portion to reach a top surface of a carrier.