US 11,973,008 B2
Signal isolator having enhanced creepage characteristics
Robert A. Briano, Auburn, NH (US); Shixi Louis Liu, Hooksett, NH (US); and William P. Taylor, Amherst, NH (US)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Feb. 14, 2022, as Appl. No. 17/650,874.
Application 17/650,874 is a division of application No. 16/574,621, filed on Sep. 18, 2019, granted, now 11,289,406.
Prior Publication US 2022/0165647 A1, May 26, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49503 (2013.01) [H01L 23/49575 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06151 (2013.01); H01L 2224/48177 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A leadless signal isolator IC package, comprising:
a leadframe including a die paddle having first and second surfaces, wherein the first and second surfaces are on opposite sides of the die paddle and are parallel to each other, the first surface to support a die and the second surface being exposed on an exterior surface of the IC package; and
a die supported by the die paddle, the die having a width,
wherein a width of the second surface of the die paddle is less than the width of the die along an entire length of the die and edges of the die along the length of the die are outside of edges of the exposed second surface of the die paddle, and
wherein a width of the first surface of the die paddle is greater than the width of the die along the entire length of the die.