US 11,971,226 B2
High temperature thermal dual-barrier coating
Zubin Jacob, West Lafayette, IN (US); Xueji Wang, West Lafayette, IN (US); Ali Jishi, West Lafayette, IN (US); and Avra Sankar Bandyopadhyay, West Lafayette, IN (US)
Assigned to Purdue Research Foundation, West Lafayette, IN (US)
Filed by Purdue Research Foundation, West Lafayette, IN (US)
Filed on Jan. 11, 2022, as Appl. No. 17/573,558.
Claims priority of provisional application 63/136,608, filed on Jan. 12, 2021.
Prior Publication US 2022/0221234 A1, Jul. 14, 2022
Int. Cl. F28F 13/18 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 14/30 (2006.01); C23C 14/34 (2006.01)
CPC F28F 13/185 (2013.01) [C23C 14/083 (2013.01); C23C 14/14 (2013.01); C23C 14/30 (2013.01); C23C 14/3464 (2013.01); Y10T 428/24917 (2015.01)] 26 Claims
OG exemplary drawing
 
1. A thermal dual-barrier coating (TDBC) system providing resistance for both conduction and radiation thermal transfer modes, comprising:
a first thermal barrier layer having a first thermal conductivity;
one or more composite structures vertically disposed adjacent the first thermal barrier layer, each of the one or more composite structures, comprising
an ultra-thin disordered semi-continuous metallic film and a layer of a second thermal barrier layer.