US 11,971,220 B2
Evaporative cooling for transducer array
Charles P. Wason, Jr., Amherst, NH (US)
Assigned to BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed by BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US)
Filed on Feb. 9, 2023, as Appl. No. 18/166,808.
Application 18/166,808 is a division of application No. 16/275,113, filed on Feb. 13, 2019, granted, now 11,578,928.
Prior Publication US 2023/0184494 A1, Jun. 15, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. F28D 15/02 (2006.01); F28D 15/04 (2006.01); G01S 7/521 (2006.01)
CPC F28D 15/0275 (2013.01) [F28D 15/04 (2013.01); G01S 7/521 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A transducer system, comprising:
a housing;
a plurality of electromechanical transducers in the housing, wherein one or more of the plurality of electromechanical transducers comprises a wicking material adjacent to a portion of the corresponding electromechanical transducer; and
a multi-phase coolant solution within the housing, wherein the multi-phase coolant solution transitions from a first phase to a second phase in response to a temperature of the electromechanical transducer exceeding a threshold temperature.