US 11,970,773 B2
Apparatus and method for atomic layer deposition (ALD)
Matti Malila, Espoo (FI); and Pekka Soininen, Espoo (FI)
Assigned to BENEQ OY, Espoo (FI)
Appl. No. 17/605,590
Filed by BENEQ OY, Espoo (FI)
PCT Filed Apr. 24, 2020, PCT No. PCT/FI2020/050267
§ 371(c)(1), (2) Date Oct. 22, 2021,
PCT Pub. No. WO2020/216994, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. 20195334 (FI), filed on Apr. 25, 2019.
Prior Publication US 2022/0275512 A1, Sep. 1, 2022
Int. Cl. C23C 16/455 (2006.01); C23C 16/458 (2006.01)
CPC C23C 16/45546 (2013.01) [C23C 16/45529 (2013.01); C23C 16/45551 (2013.01); C23C 16/4583 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An apparatus for processing one or more substrates in a batch process by subjecting at least part of a surface of a substrate to alternating surface reactions of at least a first and second starting materials according to the principles of atomic layer deposition (ALD), the apparatus comprising:
a reaction chamber forming a reaction space within the reaction chamber;
a chamber plate for closing the reaction chamber such that a closed reaction space is formed,
a motor arranged to move the chamber plate in a first direction (A) between an open position, in which the reaction chamber is open, and a closed position, in which the reaction chamber is closed, with the chamber plate,
wherein the apparatus further comprises
an actuator arm mechanism connected to said motor, the actuator arm mechanism having three or more actuator arms, each of the three or more actuator arms having a distal end, which the distal end is connected to the chamber plate, the distal ends of the three or more actuator arms define a plane on the chamber plate; and
an adjustment mechanism in connection with at least one of the three or more actuator arms, said adjustment mechanism being arranged to adjust orientation of the chamber plate relative to the reaction chamber when the chamber plate is pressed against the reaction chamber to tighten and seal the connection between the chamber plate and the reaction chamber.