US 11,970,273 B2
Seat assembly having a conductive substrate layer
Murat Saylik, Oklahoma City, OK (US); and Joseph A. Bolton, Dubuque, IA (US)
Assigned to The Boeing Company, Chicago, IL (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Apr. 22, 2020, as Appl. No. 16/855,928.
Prior Publication US 2021/0331807 A1, Oct. 28, 2021
Int. Cl. B64D 11/06 (2006.01); B64D 45/02 (2006.01); H01P 1/203 (2006.01); H05F 1/00 (2006.01); H05F 3/00 (2006.01)
CPC B64D 11/0647 (2014.12) [B64D 45/02 (2013.01); H01P 1/203 (2013.01); H05F 1/00 (2013.01); H05F 3/00 (2013.01)] 23 Claims
OG exemplary drawing
 
13. A system for reducing electromagnetic interference (EMI) in an aircraft, the system comprising:
a seat assembly of a first plurality of seat assemblies configured in one or more rows, the seat assembly comprising:
a frame including a base electrically coupled to an electric ground of the aircraft and a support member operatively coupled to the base; and
a seat coupled to the base and the support member, the seat including a conductive substrate layer configured to limit transmission of EMI between a forward area and a rear area relative to the seat assembly, the conductive substrate layer electrically coupled to the base; and
wherein the seat further comprises a first portion coupled to the base and a first side of the support member, and a second portion coupled to a second side of the support member opposite the first side, the conductive substrate layer covering the first portion and the second portion.