US 12,615,707 B2
Confinement and protection of a thermal interface material between a heat sink and an electronic device
Yi-Kuan Liao, Taoyuan City (TW); and Kuan-Lin Peng, Taoyuan City (TW)
Assigned to Super Micro Computer, Inc., San Jose, CA (US)
Filed by Super Micro Computer, Inc., San Jose, CA (US)
Filed on Aug. 4, 2023, as Appl. No. 18/365,729.
Prior Publication US 2025/0048530 A1, Feb. 6, 2025
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 2201/066 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
a heat sink, the heat sink having a first groove that is cut on a surface of the heat sink;
an electronic device;
a thermal interface material that is disposed between the heat sink and the electronic device, the thermal interface material is attached to the surface of the heat sink and to a surface of the electronic device; and
a compressible filler disposed in the first groove, the compressible filler completely surrounds the thermal interface material and confines the thermal interface material within a perimeter of the compressible filler,
wherein the heatsink has a second groove that is cut on the surface of the heat sink directly adjacent to and within a perimeter of the first groove, the second groove is shallower than the first groove and contains a spillover portion of the thermal interface material that directly contacts the compressible filler.