US 12,289,937 B2
Controlled wetting in the manufacture of electronic components
Daniel Leisen, Regensburg (DE); Simon Jerebic, Donaustauf (DE); and Max Wenzel, Altdorf (DE)
Assigned to OSRAM Opto Semiconductors GmbH, Regensburg (DE)
Appl. No. 17/432,908
Filed by OSRAM Opto Semiconductors GmbH, Regensburg (DE)
PCT Filed Feb. 25, 2020, PCT No. PCT/EP2020/054845
§ 371(c)(1), (2) Date Aug. 20, 2021,
PCT Pub. No. WO2020/173908, PCT Pub. Date Sep. 3, 2020.
Claims priority of application No. 102019104695.5 (DE), filed on Feb. 25, 2019.
Prior Publication US 2022/0077357 A1, Mar. 10, 2022
Int. Cl. H10H 20/853 (2025.01); H10H 20/01 (2025.01); H10H 20/80 (2025.01); H10H 20/854 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/853 (2025.01) [H10H 20/0362 (2025.01); H10H 20/0364 (2025.01); H10H 20/854 (2025.01); H10H 20/857 (2025.01); H10H 20/872 (2025.01)] 12 Claims
OG exemplary drawing
 
1. A device comprising:
a first surface area;
a second surface area located adjacent to the first surface area,
wherein the second surface area is configured to be repellent to a first fluid,
wherein the first surface area is wetted by the first fluid and the second surface area is uncovered by the first fluid;
a raw chip attached to a substrate;
a spray coating applied to the raw chip and to the substrate on its side facing the raw chip; and
a covering layer,
wherein a main spray-coated surface of the raw chip facing away from the substrate is the second surface area,
wherein a remainder of the spray coating with its side facing away from the substrate is the first surface area,
wherein the first fluid becomes the covering layer, and
wherein the first surface area was wetted and the second surface area remains unwetted.