US 12,289,933 B2
Semiconductor light-emitting device and manufacturing method of the same
Sho Nozawa, Tokyo (JP); Yoichi Shimoda, Tokyo (JP); and Daizo Kambara, Tokyo (JP)
Assigned to STANLEY ELECTRIC CO., LTD., Tokyo (JP)
Filed by STANLEY ELECTRIC CO., LTD., Tokyo (JP)
Filed on Jun. 22, 2022, as Appl. No. 17/846,602.
Claims priority of application No. 2021-104703 (JP), filed on Jun. 24, 2021.
Prior Publication US 2022/0416141 A1, Dec. 29, 2022
Int. Cl. H10H 20/01 (2025.01); H10H 20/814 (2025.01); H10H 20/832 (2025.01); H10H 20/841 (2025.01); H10H 20/852 (2025.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/0362 (2025.01) [H10H 20/814 (2025.01); H10H 20/835 (2025.01); H10H 20/841 (2025.01); H10H 20/852 (2025.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor light-emitting device comprising:
a substrate having a top surface and provided with a cavity, the cavity having an opening in the top surface and having a rectangular-shaped bottom surface, the bottom surface being provided with a first wiring and a second wiring, the first wiring including a first mounting portion and a second mounting portion;
a first element mounted on the first mounting portion and having a rectangular-shaped top surface, the first element including a first electrode pad near a middle point of an element reference side as one of sides that define the top surface of the first element;
a second element mounted on the second mounting portion and having a top surface, the second element including a second electrode pad on the top surface;
a first wire connecting the second wiring and the first electrode pad, the first wire including a first wire horizontal part that is level with respect to the top surface of the first element;
a second wire connecting the second wiring and the second electrode pad, the second wire including a second wire horizontal part that is level with respect to the top surface of the first element and having an approximately same height as the first wire horizontal part; and
a reflective resin having reflectivity filled in the cavity so as to expose the top surface of the first element, wherein
the first mounting portion is disposed such that a mounting portion reference side and a cavity reference side opposed to the mounting portion reference side are separated by a first separation distance, the mounting portion reference side is one of sides that define an external shape of the first mounting portion in top view, the cavity reference side is one of sides that define the bottom surface of the cavity,
the second wiring and the second mounting portion are disposed separately across a line segment in one region between the mounting portion reference side and the cavity reference side on the bottom surface of the cavity in top view, the line segment runs through a center point of a top surface of the first mounting portion and is perpendicular to the mounting portion reference side,
the first element is a light-emitting element having a top surface as a light-exiting surface, and the first element is mounted on the first mounting portion such that the first electrode pad is near the one region side of the bottom surface of the cavity, and
the reflective resin has a bulged portion in a bulged dike shape such that a surface of the reflective resin is brought into contact with at least a part of the second wire horizontal part and extends along the second wire horizontal part.