| CPC H10H 20/01 (2025.01) [H01L 21/67132 (2013.01); H01L 21/67144 (2013.01)] | 1 Claim |
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1. A method for mass transfer of a mini light-emitting diode (Mini-LED), comprising:
(S1) placing horizontally and fixing a blue membrane to which a plurality of Mini-LED chips are bonded; and placing horizontally and fixing a transfer substrate on a side of the blue membrane close to the plurality of Mini-LED chips;
(S2) detecting and adjusting, by a vision camera fixed on an ejector pin base, a height of the transfer substrate and a height of the blue membrane; wherein the vision camera is configured to identify positions of the plurality of Mini-LED chips through the blue membrane; and controlling a gantry transverse beam to move in a Y-axis direction, and controlling the ejector pin base to move in an X-axis direction, so as to drive the vision camera to position the plurality of Mini-LED chips;
(S3) after completing the positioning of the plurality of Mini-LED chips by the vision camera, performing a sliding-on-membrane pin ejection for Mini-LED chips among the plurality of Mini-LED chips in a first row along the X-axis direction; wherein an ejector pin is driven by the ejector pin base to perform a uniform movement in a positive X-axis direction along the gantry transverse beam; when the ejector pin arrives at a position which is away from a first Mini-LED chip in the first row at a preset distance, the ejector pin is controlled by the ejector pin base to move along a negative X-axis direction at a certain velocity to reduce a velocity of the ejector pin such that the ejector pin is stopped at the first Mini-LED chip in the first row to perform the sliding-on-membrane pin ejection, and at the same time, the ejector pin is controlled by the ejector pin base to move along a negative Z-axis direction to drive the blue membrane and the first Mini-LED chip in the first row to fall; during a falling process, the blue membrane is deformed, and an adhesive layer between the blue membrane and the first Mini-LED chip in the first row is torn from an edge of the first Mini-LED chip in the first row; and upon being in contact with the transfer substrate, the first Mini-LED chip in the first row is peeled off from the blue membrane under an action of an adhesion of the transfer substrate to realize the sliding-on-membrane pin ejection; and
after the sliding-on-membrane pin ejection on the first Mini-LED chip in the first row is completed, stopping controlling the ejector pin to move along the negative X-axis direction, and then performing the sliding-on-membrane pin ejection on a second Mini-LED chip in the first row, and so on, until the sliding-on-membrane pin ejection of the Mini-LED chips in the first row is completed; wherein the velocity of the ejector pin along the negative X-axis direction is less than a movement velocity of the ejector pin base along the positive X-axis direction; and
(S4) after completing the sliding-on-membrane pin ejection of the Mini-LED chips in the first row, controlling the gantry transverse beam to move in the Y-axis direction to allow the ejector pin to be aligned with a first Mini-LED chip in a second row among the plurality of Mini-LED chips based on identification of the vision camera; repeating step (S3) to perform the sliding-on-membrane pin ejection and transfer until the sliding-on-membrane pin ejection of the plurality of Mini-LED chips is completed.
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