US 12,289,908 B2
Semiconductor device having multi-bridge channel field-effect transistor including source/drain pattern with a plurality of semiconductor patterns
Seo Jin Jeong, Incheon (KR); Do Hyun Go, Hwaseong-si (KR); Seok Hoon Kim, Suwon-si (KR); Jung Taek Kim, Yongin-si (KR); Pan Kwi Park, Incheon (KR); Moon Seung Yang, Hwaseong-si (KR); Min-Hee Choi, Suwon-si (KR); and Ryong Ha, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on May 10, 2024, as Appl. No. 18/661,171.
Application 18/661,171 is a continuation of application No. 17/460,446, filed on Aug. 30, 2021, granted, now 12,021,131.
Claims priority of application No. 10-2020-0176460 (KR), filed on Dec. 16, 2020.
Prior Publication US 2024/0297234 A1, Sep. 5, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H10D 30/67 (2025.01); H10D 62/13 (2025.01)
CPC H10D 30/6735 (2025.01) [H10D 30/6757 (2025.01); H10D 62/151 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
an active pattern including a lower pattern and a plurality of sheet patterns on the lower pattern and spaced apart from the lower pattern;
a gate structure on the lower pattern and surrounding the plurality of sheet patterns;
a source/drain pattern on at least one side of the gate structure and filling a source/drain recess; and
a source/drain contact on the source/drain pattern,
wherein the source/drain pattern includes a first semiconductor pattern extending along the source/drain recess and contacting the lower pattern, a second semiconductor pattern on the first semiconductor pattern, a third semiconductor pattern on the second semiconductor pattern, and a fourth semiconductor pattern on the third semiconductor pattern and filing the source/drain recess,
a side surface of the third semiconductor pattern includes a planar portion,
a lowermost surface of the second semiconductor pattern includes a planar portion,
a lowermost surface of the third semiconductor pattern includes a planar portion,
a length of the planar portion of the lowermost surface of the second semiconductor pattern is smaller than a length of the planar portion of the lowermost surface of the third semiconductor pattern, and
a thickness of the second semiconductor pattern on the lowermost surface of the third semiconductor pattern is different from a thickness of the second semiconductor pattern on the planar portion of the side surface of the third semiconductor pattern.