US 12,289,876 B2
Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder
Jason L. Strader, Pepper Pike, OH (US)
Assigned to Laird Technologies, Inc., Chesterfield, MO (US)
Filed by Laird Technologies, Inc., Chesterfield, MO (US)
Filed on Dec. 28, 2023, as Appl. No. 18/399,085.
Application 18/399,085 is a continuation of application No. 17/327,435, filed on May 21, 2021, granted, now 11,864,366.
Claims priority of provisional application 63/028,685, filed on May 22, 2020.
Prior Publication US 2025/0024654 A1, Jan. 16, 2025
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 9/00 (2006.01); C08K 3/08 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01); C08L 83/06 (2006.01); C08L 91/06 (2006.01)
CPC H05K 9/0083 (2013.01) [C08K 3/08 (2013.01); C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08L 83/06 (2013.01); C08L 91/06 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08L 2203/20 (2013.01)] 29 Claims
OG exemplary drawing
 
1. An electromagnetic interference (EMI) absorber comprising a base or matrix material and at least one filler in the base or matrix material, wherein the at least one filler comprises aluminum powder, and wherein the EMI absorber has attenuation greater than 100 decibels per centimeter at frequencies of 18 gigahertz and above.