US 12,289,873 B2
Power module
Myung Ill You, Gwangju (KR); and Nam Sik Kong, Hwaseong-si (KR)
Assigned to HYUNDAI MOTOR COMPANY, Seoul (KR); and KIA CORPORATION, Seoul (KR)
Filed by Hyundai Motor Company, Seoul (KR); and Kia Corporation, Seoul (KR)
Filed on Nov. 11, 2022, as Appl. No. 17/985,418.
Claims priority of application No. 10-2022-0081370 (KR), filed on Jul. 1, 2022.
Prior Publication US 2024/0008231 A1, Jan. 4, 2024
Int. Cl. H05K 7/06 (2006.01); H01L 21/52 (2006.01); H01L 23/047 (2006.01); H01L 23/051 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H05K 7/20 (2006.01); H02M 1/32 (2007.01)
CPC H05K 7/20945 (2013.01) [H05K 7/06 (2013.01); H02M 1/327 (2021.05)] 9 Claims
OG exemplary drawing
 
1. A power module comprising:
a chip;
a power lead electrically connected to the chip; and
at least one substrate, each of at least one substrate including an outer metal layer bonded to an outer side portion of an insulating layer and an inner metal layer bonded to an inner side portion of the insulating layer disposed between the outer metal layer and the inner metal layer, respectively, wherein the outer metal layer and the inner metal layer have different distance between two end portions of the metal layers in a horizontal direction perpendicular to a stack direction of the metal layers so that the outer metal layer and the inner metal layer have asymmetric structures,
wherein the distance of the outer metal layer is provided to be smaller than the distance of the inner metal layer so that the outer metal layer and the inner metal layer have a same volume ratio.