US 12,289,871 B2
High temperature electronic device thermal management system
Bernard Malouin, Westford, MA (US); and Jordan Mizerak, Belmont, MA (US)
Assigned to JetCool Technologies Inc., Littleton, MA (US)
Filed by JetCool Technologies Inc., Littleton, MA (US)
Filed on Nov. 14, 2023, as Appl. No. 18/389,300.
Application 18/389,300 is a continuation in part of application No. 17/475,398, filed on Sep. 15, 2021, granted, now 11,963,341.
Claims priority of provisional application 63/078,650, filed on Sep. 15, 2020.
Prior Publication US 2024/0090180 A1, Mar. 14, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20836 (2013.01) [H05K 7/20772 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A cooling system for cooling a heat-generating electronic device, comprising:
a first cooling loop, comprising
a first coolant that is configured to remove heat created by the heat-generating electronic device,
at least one component which acts to elevate a pressure of the first coolant, and
a first heat exchanger interface that is configured to transfer heat out of the first coolant;
a bypass path bypassing the first heat exchanger interface and forming a fluid path between portions of the first cooling loop;
at least one flow controlling element configured to control a flow rate of the first coolant within the portions of the first cooling loop and a flow rate of the first coolant through the bypass path; and
a management system configured to
sense the temperature of the first coolant,
sense the current temperature at a location either inside of or outside of the location of the heat-generating electronic device,
obtain a periodic maximum temperature of an ambient environment in the vicinity of the location of the electronic device, and
control the at least one flow controlling element, based on the sensed coolant temperature and a temperature of the heat-generating electronic device, to adjust the flow rate of the first coolant within the portions of the first cooling loop and the flow rate of the first coolant through the bypass path.