US 12,289,842 B2
Method of manufacturing flexible substrate
Takumi Sano, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Apr. 19, 2023, as Appl. No. 18/302,840.
Claims priority of application No. 2022-070752 (JP), filed on Apr. 22, 2022.
Prior Publication US 2023/0345644 A1, Oct. 26, 2023
Int. Cl. B29C 65/00 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/46 (2006.01); B29C 65/02 (2006.01); B29C 65/48 (2006.01); B29C 65/50 (2006.01); B29C 65/52 (2006.01); B29C 65/74 (2006.01); B29C 65/78 (2006.01); H05K 3/00 (2006.01)
CPC H05K 3/4682 (2013.01) [H05K 1/028 (2013.01); H05K 3/28 (2013.01); B29C 65/02 (2013.01); B29C 65/4815 (2013.01); B29C 65/50 (2013.01); B29C 65/524 (2013.01); B29C 65/7419 (2013.01); B29C 65/745 (2013.01); B29C 65/7891 (2013.01); B29C 65/7894 (2013.01); B29C 66/02241 (2013.01); B29C 66/0242 (2013.01); B29C 66/431 (2013.01); B29C 66/4332 (2013.01); H05K 3/0017 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of manufacturing a flexible substrate, comprising:
forming a release layer on a glass substrate;
forming an insulating base on the release layer;
forming a plurality of insulating layers, wiring lines and electrical elements on the insulating base;
ashing the release layer, the insulating base and the plurality of insulating layers from above to the glass substrate via a mask;
forming an upper resin layer which covers the release layer, the insulating base, and the plurality of insulating layers;
removing the glass substrate and the release layer by peeling off at an interface between the release layer and the insulating base; and
forming a lower resin layer so as to be in contact with a lower surface of the insulating base and a lower surface of the upper resin layer.