US 12,289,836 B2
Method for manufacturing mounting substrate, and component mounting device
Syoichi Nishi, Fukuoka (JP); Hideki Sumi, Fukuoka (JP); Hiroshi Murata, Saga (JP); Koji Sakurai, Fukuoka (JP); and Kenichi Ichikawa, Fukuoka (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Appl. No. 17/637,101
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Jun. 9, 2020, PCT No. PCT/JP2020/022605
§ 371(c)(1), (2) Date Feb. 22, 2022,
PCT Pub. No. WO2021/044688, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-159287 (JP), filed on Sep. 2, 2019.
Prior Publication US 2022/0287212 A1, Sep. 8, 2022
Int. Cl. H05K 13/00 (2006.01); H05K 13/08 (2006.01)
CPC H05K 13/089 (2018.08) [H05K 13/0812 (2018.08); H05K 13/0815 (2018.08)] 14 Claims
OG exemplary drawing
 
1. A method for manufacturing a mounting board, the method comprising:
a first outer shape position acquisition step of imaging a component from a first direction to acquire a first outer shape position of the component;
a feature portion position acquisition step of imaging the component from the first direction to acquire a position of a feature portion formed on the component;
a calculation step of calculating a deviation amount of the position of the feature portion with respect to the first outer shape position from the first outer shape position and the position of the feature portion;
a holding step of holding the component with a holding member;
a second outer shape position acquisition step of imaging, from a second direction, the component held by the holding member to acquire a second outer shape position of the component, the second direction being different from the first direction;
a mounting step of mounting the component to a board so that the feature portion of the component is positioned on a target position of the board based on the second outer shape position and the deviation amount; and
a third outer shape position acquisition step of imaging the component to acquire a first outer shape position of the component after the feature portion position acquisition step,
wherein when a difference in positions of the first outer shape position acquired in the first outer shape position acquisition step and the first outer shape position acquired in the third outer shape position acquisition step is within a predetermined range, the component is held by the holding member.