US 12,289,829 B2
Printed wiring board
Jun Sakai, Ogaki (JP); and Takuya Inishi, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Gifu (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Feb. 23, 2023, as Appl. No. 18/173,154.
Claims priority of application No. 2022-028787 (JP), filed on Feb. 28, 2022; and application No. 2023-000806 (JP), filed on Jan. 6, 2023.
Prior Publication US 2023/0276570 A1, Aug. 31, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/115 (2013.01); H05K 3/0094 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0212 (2013.01); H05K 2203/13 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed wiring board, comprising:
a first conductor layer;
a resin insulating layer formed on the first conductor layer;
a second conductor layer formed on the resin insulating layer; and
a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer,
wherein the resin insulating layer has an opening exposing a portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and the via conductor are formed such that the second conductor layer and the via conductor include a seed layer and an electrolytic plating layer formed on the seed layer, and the resin insulating layer includes a resin material and inorganic particles dispersed in the resin material such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that the first inorganic particles have shapes that are different from shapes of the second inorganic particles.