US 12,289,826 B2
Multilayer resin substrate and electronic component
Takako Sato, Nagaokakyo (JP); and Hiroki Maegawa, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Oct. 21, 2021, as Appl. No. 17/506,923.
Application 17/506,923 is a continuation of application No. PCT/JP2020/018944, filed on May 12, 2020.
Claims priority of application No. 2019-092473 (JP), filed on May 15, 2019.
Prior Publication US 2022/0046793 A1, Feb. 10, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/0225 (2013.01); H05K 1/032 (2013.01); H05K 1/141 (2013.01); H05K 1/0271 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/0969 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer resin substrate comprising:
a plurality of insulating resin base material layers; and
a plurality of conductor patterns on at least one of the plurality of insulating resin base material layers; wherein
the plurality of conductor patterns include a planar conductor on a main surface of the plurality of insulating resin base material layers and extending into a frame shape or a planar shape;
the planar conductor includes a plurality of openings;
an aperture ratio of the plurality of openings in an outer peripheral portion of the planar conductor is less than an aperture ratio of the plurality of openings in an inner peripheral portion of the planar conductor;
the outer peripheral portion contacts an outer end of the planar conductor, when viewed in a stacking direction;
the inner peripheral portion contacts an inner end of the planar conductor, when viewed in the stacking direction, wherein the plurality of conductor patterns include the planar conductor extending into the frame shape and/or the inner peripheral portion contacts an electronic component configuration region in which an electronic component is provided, when viewed in the stacking direction, where the plurality of conductor patterns include the planar conductor extending into the planar shape;
the electronic component configuration region entirely or substantially entirely overlaps the planar conductor and is surrounded by the inner peripheral portion, when viewed in the stacking direction;
the outer peripheral portion and the inner peripheral portion are in contact with each other; and
the electronic component and the plurality of openings are both provided at a same surface of the multilayer resin substrate.