US 12,289,822 B2
Method for shielding a printed circuit board from electromagnetic interference and noise during testing
Cesar Verdugo Muñoz, Camarillo, CA (US); Jorge Luis Pineda, Aliso Viejo, CA (US); Edgar Antonio Martinez, Mexicali (MX); Daniel Murillo, Mexicali (MX); and Adrian Flores Baca, Simi Valley, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Jul. 26, 2023, as Appl. No. 18/359,805.
Application 18/359,805 is a division of application No. 17/137,968, filed on Dec. 30, 2020, granted, now 11,729,899.
Application 17/137,968 is a continuation of application No. 16/838,437, filed on Apr. 2, 2020, granted, now 11,051,397, issued on Jun. 29, 2021.
Claims priority of provisional application 62/833,064, filed on Apr. 12, 2019.
Claims priority of provisional application 62/833,125, filed on Apr. 12, 2019.
Prior Publication US 2024/0090122 A1, Mar. 14, 2024
Int. Cl. H05K 1/02 (2006.01); G01R 1/18 (2006.01); H05K 3/34 (2006.01); H05K 9/00 (2006.01)
CPC H05K 1/0225 (2013.01) [G01R 1/18 (2013.01); H05K 3/34 (2013.01); H05K 3/3447 (2013.01); H05K 9/0069 (2013.01); H05K 2203/1147 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/4913 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A method for shielding a printed circuit board from electromagnetic interference and noise during noise figure testing, comprising:
unsealing a cover from a housing to expose a printed circuit board in a cavity defined by a peripheral wall, the printed circuit board having at least one radiofrequency component mounted thereon;
removing soldering between electrical contacts on the printed circuit board and one or more pins of one or more radiofrequency connectors attached to the peripheral wall;
detaching the one or more radiofrequency connectors from the peripheral wall; and
removing the printed circuit board and inserting into the cavity a replacement printed circuit board having a radiofrequency component mounted thereon.